High-precision plating technology for glass hermetic products (sealed terminals and connectors)
With our unique cost reduction technology for materials, we can accommodate a wide range from low-cost, small-batch production to mass production.
【Features】 1. Low-cost plating treatment is possible by reducing material costs. 2. Even with electroplating, the thickness difference between the metal base and lead pins can be minimized. 3. There is less variation in film thickness due to individual differences in products. 4. A specialized plating solution that ensures wire bonding (WB) properties is used for gold plating. (Customizable depending on the project) 5. Supports multi-pins that are prone to tangling and long lead pins, as well as connectors. 6. Can accommodate difficult-to-handle small items (stem diameter φ2 and lead pin φ0.25). 7. Can also accommodate ceramic stem bases. (Plating only for lead pins)
- Company：友電舎 本社、工場
- Price：Other
